Contact Resistance Comparison of Flip-Chip Joints Produced with Anisotropic Conductive Adhesive and Nonconductive Adhesive for Smart Textile Applications (English)
- New search for: Choi, Jung-Yeol
- New search for: Choi, Jung-Yeol
- New search for: Oh, Tae Sung
In:
Materials transactions
;
56
, 10
; 1711-1718
;
2015
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ISSN:
- Article (Journal) / Print
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Title:Contact Resistance Comparison of Flip-Chip Joints Produced with Anisotropic Conductive Adhesive and Nonconductive Adhesive for Smart Textile Applications
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Contributors:Choi, Jung-Yeol ( author ) / Oh, Tae Sung
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Published in:Materials transactions ; 56, 10 ; 1711-1718
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Publisher:
- New search for: Japan Institute of Metals
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Place of publication:Sendai
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Publication date:2015
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ISSN:
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ZDBID:
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DOI:
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Type of media:Article (Journal)
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Type of material:Print
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Language:English
- New search for: 51.00
- Further information on Basic classification
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Keywords:
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Classification:
BKL: 51.00 Werkstoffkunde: Allgemeines -
Source:
Table of contents – Volume 56, Issue 10
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 1615
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Recent Advances in TASC (Thermal Activation of Semi-Conductors) Technology for Environmental Issues Focused on the Disassembly and Recycling of Solar Panels and Laminated Glass -A New Technology Characterized by Radical Propagation in Giant MoleculesMizuguchi, Jin et al. | 2015
- 1626
-
Effects of Coiling Temperature on the Microstructures, Mechanical Properties and Textures of 08Al Deep Drawing Steel SheetShi, Feng et al. | 2015
- 1633
-
Effect of Focal Depth of HAADF-STEM Imaging on the Solute Enriched Layers in Mg AlloysKiguchi, Takanori et al. | 2015
- 1639
-
Automatic Reconstruction Approach to Characterization of Prior-Austenite Microstructure in Various Japanese SwordsPham, Anh H et al. | 2015
- 1648
-
Frictional and Wear Behavior of Commercially Pure Ti, Ti-6Al-7Nb, and SUS316L Stainless Steel in Artificial Saliva at 310 KMiura-Fujiwara, Eri et al. | 2015
- 1658
-
Strain Softening Induced by High Pressure Torsion in Copper AlloysPang, Yanzhao et al. | 2015
- 1664
-
Electrodeposition Behavior of Zn-Fe Alloy from Zincate Solution Containing TriethanolamineNakano, Hiroaki et al. | 2015
- 1670
-
Refinement of Thermodynamic Parameters of the Mg24Y5, W and H Phases in the Mg-Zn-Y SystemMinamoto, Satoshi et al. | 2015
- 1675
-
Compositional Optimization of Al-Mn-X Alloys and, Their Tensile and Corrosion PropertiesMatsugi, Kazuhiro et al. | 2015
- 1683
-
Thermal Stress-Based Diffusion Bonding Method: the Case of Oxygen Free Copper to 316L Stainless SteelHarumoto, Takashi et al. | 2015
- 1683
-
Thermal Stress-Based Diffusion Bonding MethodTakashi Harumoto et al. | 2015
- 1688
-
Alloying Effects on Hydrogen Solubility and Hydrogen Permeability for V-Based Alloy MembranesSuzuki, A et al. | 2015
- 1693
-
Nickel Formation on Graphite Sheet Surface for Improving Wettability with Magnesium AlloyYao, Youqiang et al. | 2015
- 1698
-
Influence of Swaging on the Magnetic Properties of Zn-Bonded Sm-Fe-N MagnetsKohei Kataoka et al. | 2015
- 1703
-
Evaluation of Adhesion of Hydroxyapatite Films Fabricated on Biomedical β-Type Titanium Alloy after Immersion in Ringer's SolutionHieda, Junko et al. | 2015
- 1711
-
Contact Resistance Comparison of Flip-Chip Joints Produced with Anisotropic Conductive Adhesive and Nonconductive Adhesive for Smart Textile ApplicationsChoi, Jung-Yeol et al. | 2015
- 1719
-
Thermoelectric Power-Generation Characteristics of a Thin-Film Device Processed by the Flip-Chip Bonding of Bi2Te3 and Sb2Te3 Thin-Film Legs Using an Anisotropic Conductive AdhesiveShin, Kang-Je et al. | 2015
- 1725
-
Coral Sand Solidification Test Based on Microbially Induced Carbonate Precipitation Using Ureolytic BacteriaKhan, Md. Nakibul Hasan et al. | 2015
- 1733
-
Silicate Covering Layer on Pyrite Surface in the Presence of Silicon-Catechol Complex for Acid Mine Drainage PreventionYuniati, Mutia Dewi et al. | 2015
- 1742
-
Effects of Pulse Bias Duty Cycle on Composition, Structure and Hardness of Ti-Cu-N Nanocomposite Films Deposited by Pulse Biased Arc Ion PlatingWang, W et al. | 2015
- 1747
-
Compositional Optimization of β Type Titanium Alloys with Shape Memory Ability and Their CharacteristicsMatsugi, Kazuhiro et al. | 2015
- 1747
-
Compositional Optimization of [beta] Type Titanium Alloys with Shape Memory Ability and Their CharacteristicsKazuhiro Matsugi et al. | 2015
- 1756
-
Magnesium Sorting by Vibrating Particulate Bed from Mixed Metal ScrapMorishige, Taiki et al. | 2015