Erratum: “Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study” [ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069] (English)
- New search for: Siow, K. S
- New search for: Siow, K. S
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In:
Journal of electronic packaging
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138
, 3
;
2016
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ISSN:
- Article (Journal) / Print
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Title:Erratum: “Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study” [ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069]
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Contributors:Siow, K. S ( author ) / Lin, Y. T
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Published in:Journal of electronic packaging ; 138, 3
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Publisher:
- New search for: ASME
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Place of publication:New York, NY
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Publication date:2016
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ISSN:
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ZDBID:
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DOI:
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Type of media:Article (Journal)
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Type of material:Print
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Language:English
- New search for: 33.38 / 53.54 / 53.50 / 53.09
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Source:
Table of contents – Volume 138, Issue 3
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 31006
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Effect of Design Parameters on Thermomechanical Stress in Silicon of Through-Silicon ViaHwang, Joo-Sun et al. | 2016
- 31008
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Numerical and Experimental Investigation of Shell-and-Tube Phase-Change Material Thermal Energy Storage UnitSherer, Thomas H et al. | 2016
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Double-Layer Microchannel Heat Sinks With Transverse-Flow ConfigurationsAnsari, Danish et al. | 2016
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Erratum: “Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study” [ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069]Siow, K. S et al. | 2016
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Surface and Indoor Temperature Effects on User Thermal Responses to Holding a Simulated Tablet ComputerZhang, Han et al. | 2016
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Thermal Response of Multi-Microchannel Evaporators During Flow Boiling of Refrigerants Under Transient Heat Loads With Flow VisualizationHuang, Houxue et al. | 2016
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Recent Advances and New Trends in Flip Chip TechnologyLau, John H et al. | 2016
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Creep Constitutive Models Suitable for Solder Alloys in Electronic AssembliesMukherjee, Subhasis et al. | 2016
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Use of a Gel Finger to Feel the Skin Temperatures of a SmartphoneSripada, Akshay et al. | 2016
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Reviewers Acknowledgment for the Journal of Electronic Packaging| 2016
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Flexible RFID Tag Inductor Printed by Liquid Metal Ink Printer and Its CharacterizationGao, Yunxia et al. | 2016
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Modified Body Force Model for Air Flow Through Perforated Floor Tiles in Data CentersArghode, Vaibhav K et al. | 2016