Single- and Two-Phase Particle Image Velocimetry Characterization of Fluid Flow Within a Liquid Immersion Cooled Electronics Module (English)
- New search for: Gess, Joshua
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In:
Journal of electronic packaging
;
138
, 4
;
2016
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ISSN:
- Article (Journal) / Print
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Title:Single- and Two-Phase Particle Image Velocimetry Characterization of Fluid Flow Within a Liquid Immersion Cooled Electronics Module
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Contributors:
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Published in:Journal of electronic packaging ; 138, 4
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Publisher:
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Place of publication:New York, NY
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Publication date:2016
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ISSN:
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DOI:
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Type of media:Article (Journal)
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Type of material:Print
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Language:English
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Source:
Table of contents – Volume 138, Issue 4
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
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Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock ResponseKallolimath, Sharan et al. | 2016
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Single- and Two-Phase Particle Image Velocimetry Characterization of Fluid Flow Within a Liquid Immersion Cooled Electronics ModuleGess, Joshua et al. | 2016
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Modeling of a Smart Heat Pump Made of Laminated Thermoelectric and Electrocaloric MaterialsFeng, Dudong et al. | 2016
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Modular Microfluidic Filters Based on Transparent MembranesArchibong, E et al. | 2016
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Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film MaterialsZhao, Dongliang et al. | 2016
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Effect of Solder Joint Thickness on Intermetallic Compound Growth Rate of Cu/Sn/Cu Solder Joints During Thermal AgingZhu, Yan et al. | 2016
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Optimization of a Thermoelectric Cooler for Time-Varying Heat Load and Sink TemperaturePearson, Matthew R et al. | 2016
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A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat ConductionChen, Cheng et al. | 2016
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Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip StacksBrunschwiler, Thomas et al. | 2016
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Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental ConditionsMahan, Kenny et al. | 2016
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Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction CouplesHsu, Shou-Jen et al. | 2016
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Flow Boiling in Microgaps for Thermal Management of High Heat Flux MicrosystemsHan, Xuefei et al. | 2016