Special Section on IMECE 2016 (English)
- New search for: Weibel, Justin A
- New search for: Weibel, Justin A
- New search for: Annapragada, S. Ravi
In:
Journal of electronic packaging
;
139
, 2
;
2017
-
ISSN:
- Article (Journal) / Print
-
Title:Special Section on IMECE 2016
-
Contributors:Weibel, Justin A ( author ) / Annapragada, S. Ravi
-
Published in:Journal of electronic packaging ; 139, 2
-
Publisher:
- New search for: ASME
-
Place of publication:New York, NY
-
Publication date:2017
-
ISSN:
-
ZDBID:
-
DOI:
-
Type of media:Article (Journal)
-
Type of material:Print
-
Language:English
- New search for: 33.38 / 53.54 / 53.50 / 53.09
- Further information on Basic classification
- New search for: 770/5670
-
Keywords:
-
Classification:
-
Source:
Table of contents – Volume 139, Issue 2
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
-
Thermal Performance of a Light Emitting Diode Light Engine for a Multipurpose Automotive Exterior Lighting System With Competing Board TechnologiesZeynep Uras, Umut et al. | 2017
-
Transient Analysis of Nonuniform Heat Input Propagation Through a Heat Sink BaseSudhakar, Srivathsan et al. | 2017
-
Mechanical Testing for Stretchable ElectronicsKlein, Steven A et al. | 2017
-
Effect of the Crystallinity on the Electromigration Resistance of Electroplated Copper Thin-Film InterconnectionsKato, Takeru et al. | 2017
-
Heat Transfer in Liquid–Liquid Taylor Flow in Miniscale Curved Tubing for Constant Wall TemperatureAdrugi, Wesam et al. | 2017
-
Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated CircuitsChoobineh, Leila et al. | 2017
-
Characterization of Bulk and Thin Film Fracture in Electronic PackagingSubramanian, Vijay et al. | 2017
-
Assembly of Heterogeneous Materials for Biology and Electronics: From Bio-Inspiration to Bio-IntegrationGao, Yuyan et al. | 2017
-
Carrier Mobility Shift in Advanced Silicon Nodes Due to Chip-Package InteractionSukharev, Valeriy et al. | 2017
-
Experimental Development and Computational Optimization of Flat Heat Pipes for CubeSat ApplicationsIsaacs, Steven A et al. | 2017
-
Three-Dimensional Printed Dielectric Substrates for Radio Frequency ApplicationsSnigdha Tummala, Vana et al. | 2017
-
High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam MethodSankarasubramanian, Santosh et al. | 2017
-
Special Section on IMECE 2016Weibel, Justin A et al. | 2017
-
Qualitative Study of Cumulative Corrosion Damage of Information Technology Equipment in a Data Center Utilizing Air-Side Economizer Operating in Recommended and Expanded ASHRAE EnvelopeShah, Jimil M et al. | 2017