Enhanced Bonding by Applied Current in Cu-to-Cu Joints Fabricated Using 20 μm Cu Microbumps (English)
- New search for: Woo Ma, Sung
- New search for: Woo Ma, Sung
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In:
Journal of electronic packaging
;
139
, 4
;
2017
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ISSN:
- Article (Journal) / Print
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Title:Enhanced Bonding by Applied Current in Cu-to-Cu Joints Fabricated Using 20 μm Cu Microbumps
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Contributors:
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Published in:Journal of electronic packaging ; 139, 4
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Publisher:
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Place of publication:New York, NY
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Publication date:2017
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ISSN:
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ZDBID:
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DOI:
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Type of media:Article (Journal)
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Type of material:Print
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Language:English
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Table of contents – Volume 139, Issue 4
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
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Ultraminiaturized Three-Dimensional IPAC Packages With 100 μm Thick Glass Substrates for Radio Frequency Front-End ModulesWu, Zihan et al. | 2017
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Display Light Guide Swelling Due to Moisture AbsorptionCousins, A. K et al. | 2017
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Effectiveness of Rack-Level Fans—Part I: Energy Savings Through ConsolidationEiland, Richard et al. | 2017
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Effectiveness of Rack-Level Fans—Part II: Control Strategies and System RedundancyFernandes, John Edward et al. | 2017
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Airflow Management on the Efficiency Index of a Container Data Center Having Overhead Air SupplyWang, Cheng-Hao et al. | 2017
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Determination of Energy Release Rate Through Sequential Crack ExtensionMcCann, Scott et al. | 2017
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Effects of Stacked Layers and Stacked Configurations on Wire Sweep and Wire Sag of Advanced Overhang/Pyramid Stacked PackagesKung, Huang-Kuang et al. | 2017
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Embarked Quad Flat Nonlead 16, 32, and 64 Electronic Devices Subjected to Free Convection: Influence of the Adhesive Paste on the Junction TemperatureBaïri, Abderrahmane et al. | 2017
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Ball Grid Array Interconnection Properties of Solderable Polymer–Solder Composites With Low-Melting-Point Alloy FillersYim, Byung-Seung et al. | 2017
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Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip BondingTakahashi, Yasuo et al. | 2017
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Thermal Performance and Efficiency of a Mineral Oil Immersed Server Over Varied Environmental Operating ConditionsEiland, Richard et al. | 2017
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Enhanced Bonding by Applied Current in Cu-to-Cu Joints Fabricated Using 20 μm Cu MicrobumpsWoo Ma, Sung et al. | 2017