Production of metallic patterns with the help of highresolution inorganic resists (English)
- New search for: Stronski, Alexander V.
- New search for: Stronski, Alexander V.
In:
Microelectronic Interconnections and Assembly
8
;
263-293
;
1998
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ISSN:
- Article/Chapter (Book) / Electronic Resource
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Title:Production of metallic patterns with the help of highresolution inorganic resists
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Contributors:Stronski, Alexander V. ( author )
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Published in:Microelectronic Interconnections and Assembly , 8 ; 263-293NATO ASI Series ; 54, 8 ; 263-293
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Publisher:
- New search for: Springer Netherlands
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Place of publication:Dordrecht
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Publication date:1998-01-01
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Size:31 pages
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ISBN:
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ISSN:
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DOI:
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Type of media:Article/Chapter (Book)
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Type of material:Electronic Resource
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Language:English
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Keywords:
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Source:
Table of contents eBook
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 1
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The Packaging & Interconnection Trends in the Nordic Microelectronics IndustryNørlyng, Søren et al. | 1998
- 9
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IC Packaging for Miniaturised Consumer ElectronicsVeen, Co et al. | 1998
- 13
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The Move Towards Further MiniaturisationSage, M. G. et al. | 1998
- 21
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Plastic Packaging is Highly ReliableProf. Sinnadurai, Nihal et al. | 1998
- 33
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Thermal Simulation and Characterization of Single Chip PackagesSlattery, Orla / Cahill, Ciaran / Barrett, John / O’Flaherty, Martin / Rodgers, Kenneth et al. | 1998
- 45
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Current Trends and Future Issues in SolderabilityEwell, Gary J. et al. | 1998
- 53
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The At-Temperature Mechanical Properties of Lead-Tin Based AlloysJones, W. Kinzy / Liu, Y. Q. / Zampino, Marc A. / Gonzalez, Gerardo L. et al. | 1998
- 59
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Flip Chip Technology: Is It Time of Mass Production?Cognetti, Carlo et al. | 1998
- 77
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Flip-Chip - The Ultimate Solution Comparing Flip-Chip and Chip Scale PackagingBrox, Bill / Boustedt, Katarina et al. | 1998
- 79
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Solder and Solderless Flip Chip Assembly on a MCM-D in a BGA PackageBodo, Peter / Hentzell, Hans / Strandberg, Jan / Haglund, Joacim / Valizadeh, Sima et al. | 1998
- 81
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Solder Bumping for Flip Chip InterconnectionsAnnala, P. / Kaitila, J. / Salonen, J. / Suni, I. et al. | 1998
- 87
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Reliability of Solder Joint Interconnections in Thermally Matched AssembliesSuhir, E. et al. | 1998
- 97
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Mechanical Stress in Microelectronic InterconnectsGielisse, Peter J. / Tu, Meirong / White, Dongming Y. / Famu-Fsu, Yang Xu et al. | 1998
- 109
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Low Cost Interconnection Technology for Fast Prototyping of Multichip ModulesIllyefalvi-Vitéz, Zsolt / Pinkola, János / Gál, László / Tóth, Endre et al. | 1998
- 119
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Opto-Electronic Multi-Chip Modules (OE-MCMs): Current R&D and Applications to Microelectronic InterconnectionsMukherjee, Sayan D. et al. | 1998
- 141
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On Thin Film MCM-D InterconnectsRoggen, J. / Beyne, E. / Truzzi, C. / Ringoot, E. / Pieters, P. et al. | 1998
- 145
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VLSI Interconnection by Bumpless TABDehaine, Gérard / Courant, Patrick / Kurzweil, Karel et al. | 1998
- 157
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Critical Issues in Wire-Bonded Chip Interconnections to the Year 2001Harman, George G. et al. | 1998
- 167
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Bonding of Al Wires to Copper Contacts on PCBs and Alumina Substrates - a Comparative StudyCież, Michał et al. | 1998
- 179
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Microwelding of Leads to the Film Structures Working at Elevated TemperaturesPisarkiewicz, T. / Habdank-Wojewodzki, T. / Ciez, M. et al. | 1998
- 185
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New Trends in the Integration and Education in Microsystems TechnologyProf. Dr. Banský, Juraj et al. | 1998
- 187
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MCM Implementation of a 2.5 Gb/s ATM switchPlaza, Pierre / Conesa, Jose Luis et al. | 1998
- 193
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Processing and Performance of High Dielectric Permeability Thin Anodised Films in Multilayer Structures for MCM(D) High Speed Digital ApplicationsDr. Arnaudov, Radosvet G. / Yordanov, Nikola / Dr. Sc. Phillipov, Phillip et al. | 1998
- 213
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Optical Interconnection Elements Investigation in Chalcogenide Glass Layers for Integrated OpticsKikinesshy, A. / Marjan, M. / Vlasov, V. / Mojzes, I. / Ripka, G. et al. | 1998
- 217
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Material Composition Changes During High Temperature Annealing and Electrochemical Migration ReliabilityHarsányi, Gábor / Pernes, Liana / Jones, W. Kinzy et al. | 1998
- 225
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Nonlinearity between Interconnection and Resistive LayerMach, Pavel et al. | 1998
- 233
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Education in Hybrid Microelectronics at the University of BrnoSzendiuch, Ivan et al. | 1998
- 237
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Thick Film Interconnections for Sensor ApplicationsBelavič, Darko / Maček, Srečko / Šoba, Stojan / Pavlin, Marko / Hrovat, Marko / Ročak, Dubravka et al. | 1998
- 249
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PTF (Polymer Thick Film) Interconnections in Term of Long Time ReliabilityUrbančík, Ján et al. | 1998
- 257
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The Usage of the Polymer Inks in Interconnection TechnologyKolesár, František / Somora, Miloš et al. | 1998
- 263
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Production of metallic patterns with the help of highresolution inorganic resistsStronski, Alexander V. et al. | 1998