Copper–Tin Reactions in Flip Chip Solder Joints (English)
National licence
- New search for: Tu, King-Ning
- New search for: Tu, King-Ning
In:
Solder Joint Technology
2
;
111-125
;
2007
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ISSN:
- Article/Chapter (Book) / Electronic Resource
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Title:Copper–Tin Reactions in Flip Chip Solder Joints
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Contributors:Tu, King-Ning ( author )
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Published in:Solder Joint Technology , 2 ; 111-125Springer Series in Materials Science ; 117, 2 ; 111-125
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Publisher:
- New search for: Springer New York
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Place of publication:New York, NY
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Publication date:2007-01-01
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Size:15 pages
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ISBN:
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ISSN:
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DOI:
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Type of media:Article/Chapter (Book)
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Type of material:Electronic Resource
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Language:English
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Keywords:
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Source:
Table of contents eBook
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 1
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IntroductionTu, King-Ning et al. | 2007
- 37
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Copper–Tin Reactions in Bulk SamplesTu, King-Ning et al. | 2007
- 73
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Copper–Tin Reactions in Thin-Film SamplesTu, King-Ning et al. | 2007
- 111
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Copper–Tin Reactions in Flip Chip Solder JointsTu, King-Ning et al. | 2007
- 127
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Kinetic Analysis of Flux-Driven Ripening of Copper–Tin ScallopsTu, King-Ning et al. | 2007
- 153
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Spontaneous Tin Whisker Growth: Mechanism and PreventionTu, King-Ning et al. | 2007
- 211
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Fundamentals of ElectromigrationTu, King-Ning et al. | 2007
- 245
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Electromigration in Flip Chip Solder JointsTu, King-Ning et al. | 2007
- 289
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Polarity Effect of Electromigration on Solder ReactionsTu, King-Ning et al. | 2007
- 305
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Ductile–to-Brittle Transition of Solder Joints Affected by Copper–Tin Reaction and ElectromigrationTu, King-Ning et al. | 2007
- 327
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ThermomigrationTu, King-Ning et al. | 2007