Rheological Properties of Solder Paste Containing Lead-free Solder Particles Coated with Polymer Wax Particles (Unknown)
- New search for: Kim, Jeong-Hwan
- New search for: Ahn, Ji-Whan
- New search for: Kim, Jeong-Hwan
- New search for: Ahn, Ji-Whan
In:
Geosystem Engineering
;
7
, 3
;
63-68
;
2004
- Article (Journal) / Electronic Resource
-
Title:Rheological Properties of Solder Paste Containing Lead-free Solder Particles Coated with Polymer Wax Particles
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Contributors:Kim, Jeong-Hwan ( author ) / Ahn, Ji-Whan ( author )
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Published in:Geosystem Engineering ; 7, 3 ; 63-68
-
Publisher:
- New search for: Taylor & Francis Group
-
Publication date:2004-09-01
-
Size:6 pages
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ISSN:
-
DOI:
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Type of media:Article (Journal)
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Type of material:Electronic Resource
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Language:Unknown
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Keywords:
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Source:
Table of contents – Volume 7, Issue 3
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 57
-
Removal of PVC from Mixed Plastic Waste by Gravity Separation ProcessChoi, Woo-Zin et al. | 2004
- 63
-
Rheological Properties of Solder Paste Containing Lead-free Solder Particles Coated with Polymer Wax ParticlesKim, Jeong-Hwan / Ahn, Ji-Whan et al. | 2004
- 69
-
The Effects of P2O5 on the Synthesis of Tri-, Di-calcium Silicates, Tricalcium Aluminate and Ferrite PhaseYou, Kwang-Suk / Cheon, Sung-Min / Ahn, Ji-Whan et al. | 2004
- 75
-
Performance Assessment of the Circular-Cut Blasting by Numerical AnalysisJong, Yonghun / Lee, Chung-In / Jeon, Seokwon / Cho, Young-Dong / Shim, Dong-Soo et al. | 2004