Good declaration practice (English)
- New search for: Schulz, Gerd
- New search for: Pophal, Christian
- New search for: Sartorius, Ingo
- New search for: Dietrich, Marcus
- New search for: Schulz, Gerd
- New search for: Pophal, Christian
- New search for: Sartorius, Ingo
- New search for: Dietrich, Marcus
In:
Driving Forces for Future Electronics, Joint International Congress and Exhibition and Electronic Goes Green 2004+, 2004
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109-112
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2004
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ISBN:
- Conference paper / Print
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Title:Good declaration practice
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Additional title:Praxis der Warenbezeichnung
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Contributors:Schulz, Gerd ( author ) / Pophal, Christian ( author ) / Sartorius, Ingo ( author ) / Dietrich, Marcus ( author )
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Published in:
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Publisher:
- New search for: Fraunhofer IRB
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Place of publication:Stuttgart
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Publication date:2004
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Size:4 Seiten
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ISBN:
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Type of media:Conference paper
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Type of material:Print
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Language:English
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Keywords:
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Source:
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 83
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Green electronics: a U.S. perspective on policy, risk, and product designSchoenung, Julie M. / Ogunseitan, Oladele A. / Saphores, Jean-Daniel M. / Shapiro, Andrew A. et al. | 2004
- 109
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Good declaration practiceSchulz, Gerd / Pophal, Christian / Sartorius, Ingo / Dietrich, Marcus et al. | 2004
- 115
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WEEE legislation, treatment and reuse activities in HungaryGaramvölgyi, Ernö / Istvan, Zsolt et al. | 2004
- 121
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WEEE in Slovenia - before and after the 13th of August 2004Laurencic, Sergej et al. | 2004
- 123
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Development of a sustainable WEEE recovery infrastructure in Finland and stages of end-of-life management of electronicsPongracz, Eva / Ylä-Mella, Jenni / Nurminen, Jani / Tanskanen, Pia / Kaakinen, Juhani / Philips, Paul S. / Keiski, Riitta L. et al. | 2004
- 135
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Experiences with WEEE take back systems using the example of mobile phonesBeigl, Peter / Schneider, Felicitas / Salhofer, Stefan et al. | 2004
- 141
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Comparison of European monitoring standards for the recycling of CFC-containing refrigerators and freezersHug, Erhard / Chappot, Anne-Christine / Franov, Emil / Gauglhofer, Johannes / Hischier, Roland / Wäger, Patrick / Hediger, Robert et al. | 2004
- 147
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Safe recovery of liquid crystal displays (LCDs) in compliance with WEEEMartin, Roland / Simon-Hettich, Brigitte / Becker, Werner et al. | 2004
- 153
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Sustainable products and non-sustainable manufacturing systems: a paradigm shift cannot be missedNagel, M.H. / Tomiyama, T. et al. | 2004
- 165
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Theoretical consideration on optimization of self-sustainable recycling systemHayashi, Hidetaka / Suga, Tadatomo et al. | 2004
- 175
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Lead-free board marking as marking for environmental issuesStobbe, Irina / Liong, Budianto / Nimmo, Kay et al. | 2004
- 191
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Life-cycle impacts of lead and lead-free solder use in reflow soldering of electronics manufacturingGeibig, Jack R. / Socolof, Maria L. et al. | 2004
- 229
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Environmental, social and economical implications of cross-border second-hand EE product flowsLeinotaite-Budriene, Lina et al. | 2004
- 235
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Simulation analysis of globally integrated logistics and recycling strategiesSong, Sang-Jae / Kubota, Hiroshi et al. | 2004
- 241
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Supply chain management in take back of WEEEEckerth, Gregor et al. | 2004
- 245
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Take back needs logisticsHansen, Uwe et al. | 2004
- 257
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Disposal-behaviour prognosis for electrical consumer goodsHora, Maike et al. | 2004
- 263
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Approaches to estimate future quantities of waste electrical and electronic equipment (WEEE)Walk, Wolfgang et al. | 2004
- 269
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Rules on compliance with article 7 of the WEEE directive - monitoring reuse, recycling and recovery ratesSander, Knut / Zangl, Stephanie et al. | 2004
- 275
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'Active disassembly using smart materials' end of life technology for WEEE - results from the framework V projectArnaiz, Sixto / Bodenhoefer, Karl / Harrison, David / Herrmann, Constantin / Hussein, Habib / Irasarri, Luis / Malaina, Mercedes / Schnecke, Doreen / Tanskanen, Pia et al. | 2004
- 281
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Hybrid disassembly system for cellular telephone end-of-life treatmentKniebel, Martin / Basdere, Bahadir / Seliger, Günther et al. | 2004
- 325
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Requirements, solutions and conversion roadmap for lead free- and halogen free IC-devices and componentsBurger, Klaus et al. | 2004
- 347
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Whisker formation on Sn-plated componentsOberndorff, Pascal / Klerk, Jacob / Dittes, Marc / Crema, Paolo et al. | 2004
- 353
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Proposal of accelerated life - test methodology for lead-free electronic productsDrozd, Zdzslaw / Drozd, Jaroslaw / Szwech, Marcin et al. | 2004
- 363
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Effect of interfacial microstructure on joint strength between Sn-Ag-Cu and Sn-Zn-Bi solders and Cu substrateHirose, Akio / Yanagawa, Hiroto / Ide, Eiichi / Kobayashi, Kojiro F. et al. | 2004
- 369
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Development of micro-structured Sn-2Ag-0.1Al solder with highly thermal fatigue durabilityTanaka, Junichi / Takashima, Toshiyuki / Yoshimi, Kenji / Serizawa, Koji / Narita, Toshio et al. | 2004
- 373
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Simple removal method of enriched copper from lead-free soldering bathNishikawa, Hiroshi / Takemoto, Tadashi / Takahashi, Toshihide et al. | 2004
- 381
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PCBs with immersion tin finish - some experiences with lead-free reflow processBukat, Krystyna / Koziol, Grazyna / Sitek, Janusz / Borecki, Janusz / Hackiewicz, Halina / Merkle, Holger / Schröder, Sabine / Girulska, Anna / Gardela, Krzystof et al. | 2004
- 393
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The influence of the micro alloying element Ni on mechanical and soldering properties of tin copper alloysLäntzsch, Michael / Jost, Gregor / Berger, Thomas et al. | 2004
- 401
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Practical application of lead free solder in electronic productionChae, Kyu-Sang / Min, Jae-Sang / Kim, Ik-Joo / Cho, Jil-Je et al. | 2004
- 413
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Wave soldering process with Sn-Zn lead-free soldersKatayama, Naoki / Tanaka, Hiroyuki / Akanuma, Masanobu / Miyazaki, Makoto / Ogata, Shigeyuki / Yoshida, Akio / Nishiyama, Yoshihiro et al. | 2004
- 421
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Evaluation of environmental and biological impact of Pb-free solderSatoh, Hiroshi / Chiba, Momoko / Takamatsu, Takejiro / Kuboi, Toru / Omae, Kazuyuki et al. | 2004
- 433
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Sustainable use and restrictions of metals in the electronics industryDeubzer, Otmar / Reichl, Herbert / Madsen, Jacob / Griese, Hansjörg / Wel, Hans van der et al. | 2004
- 447
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Estimating environmental impact scores and related uncertainties using the eco-PaS methodologyDewulf, Wim / Duflou, Joost R. et al. | 2004
- 453
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Mind your steps towards sustainability - developing product sustainability indicators for cellular phonesStutz, Markus / Graulich, Kathrin / Ebinger, Frank et al. | 2004
- 461
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Life cycle assessment of D-Lamp (XENARC)Wongdeethai, Angkarn / Ertel, Jürgen et al. | 2004
- 469
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Implementation ecodesign for EEE-productsEikelenberg, Nicole L.W. / Kok, Irma C. / Tempelmann, Erik et al. | 2004
- 475
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Integrating life cycle analysis (LCA) with process modellingYue Nina Chen / McRae, Gregory J. et al. | 2004
- 481
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Designing environmentally friendly products in conformity with the market - a holistic analysis of product characteristicsOberender, Christof / Birkhofer, Herbert et al. | 2004
- 487
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Requirements and solutions for a practicable ecological product assessmentNissen, Nils F. / Paeglow, Sabrina / Walachowicz, Frank et al. | 2004
- 495
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Analysis of the characteristics of QFDE and LCA for ecodesign supportSakao, Tomohiko / Kaneko, Kazuhiko / Masui, Keijiro / Tsubaki, Hiroe et al. | 2004
- 541
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Environmental life cycle information management and acquisition - first experiences and results from field trialsBodenhoefer, Karl / Schneider, Andreas / Cock, Tim / Brooks, Andrew / Sands, Graham / Allman, Lee / Simon, Matthew / Seng Kwong Chong / Yang, Kevin / Delannoy, Oliver et al. | 2004
- 551
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Strategies for compliance and DfE: managing data throughout the supply chainGoodall, Catherine et al. | 2004
- 571
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Polytronics - technological trends and enviromental issuesBock, K. / Burghart, M. / Klink, G. / Pötter, H. / Müller, J. / Hagelüken, M. et al. | 2004
- 603
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Micro systems design work flows - assessment of environmental driven criteriaOng, Kilian / Schischke, Karsten / Kasper, Manfred / Middendorf, Andreas / Griese, Hansjoerg / Reichl, Herbert et al. | 2004
- 617
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A MEMs based planar micro fuel cell with self breathing cathode sideWagner, Stefan / Hahn, Robert / Krumbholz, Steffen / Reichl, Herbert et al. | 2004
- 653
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Gold recovery from printed wiring board using bioleachingKita, Yoshito / Nishikawa, Hiroshi / Takemoto, Tadashi et al. | 2004
- 657
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Eco efficient optimization of pre-processing and metal smeltingHeukelem, Arnout M.H. / Reuter, Markus A. / Huisman, Jaco / Hagelüken, Christian / Brusselaers, Johan et al. | 2004
- 663
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SEES project - how to improve the recyclability potential of automotive electronicsAlonso, Juan Carlos / Lichtenvort, Kerstin / Arnaiz, Sixto et al. | 2004
- 677
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Industrial network: recycling plastics from WEEEMäurer, Andreas / Schlummer, Martin et al. | 2004
- 683
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Recyclable IMD: a solution for decorated plastic parts?Schnecke, Doreen / Günther, Jörg et al. | 2004
- 691
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WLAN versus LAN - environmental impacts of small and medium sized local area networksHottenroth, Heidi / Quack, Dietlinde et al. | 2004
- 703
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Life cycle assessment of 3rd generation Nokia handsetMcLaren, Jake / Piukkula, Niina et al. | 2004
- 747
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Thermoplastic printed circuit boards for future electronicsMöller, Martin / Gensch, Carl-Otto / Altstädt, Volker / Behrend, Mathias / Glöde, Stefan / Kostelnik, Jan / Langenfelder, Dieter / Landeck, Hubert / Park, Heyje / Scheel, Wolfgang et al. | 2004
- 759
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Measurement of VOC and SVOC emissions from computer monitors with a 1 m3 emission test chamberWensing, Michael et al. | 2004
- 767
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Highly efficient flame retardant curing agent for epoxy resinsBlumdell, C. / Levchik, S. / Piotrowski, A. et al. | 2004
- 777
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Sustainability concerns for flame retarded plastics used in electrical and electronic equipment applicationsDawson, Raymond B. / Landry, Susan D. et al. | 2004
- 783
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Environmental and economic implications of a shift to halogen-free printed wiring boardsBergendahl, Carl Gumnar / Lichtenvort, Kerstin / Johansson, Glenn / Zackrisson, Mats / Nyyssönen, Jonna et al. | 2004
- 797
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Improving the environmental performance of in situ PECVD chamber cleaning processes by studies of CVD reactor clean performance and field evaluation of optimised processesSistern, Mark I. / Johnson, Andrew D. / Elder, Delwin L. / Ji, Bing / Karwacki, Eugene J. et al. | 2004
- 871
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Managing energy related green house gas emission: what are your options?Meissen, Ron / Eagan, Patrick et al. | 2004
- 901
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Environmentally friendly semiconductor packages: the design of an innovative leadless package conceptKilger, Thomas / Theuss, Horst / Paulus, Stefan / Dangelmaier, Jochen / Dittes, Marc / Pressel, Klaus et al. | 2004
- 907
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Practical study o implementing measures for EuP on the example of an environmental roadmap of embedded componentsHerrmann, Constantin et al. | 2004
- 987
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The EuP directive proposal: a framework for continuous improvement of the environmental performance of energy-using productsPapadoyannakis, Michail / Brisaer, Andre et al. | 2004
- 991
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Towards an optimalization of the proposed framework directive for the setting of eco-design requirements for energy-using products (EuP)Schoenmakers, Theo / Stevels, Ab et al. | 2004