Thermal stability of electrodeposited Ni-Re-P diffusion barrier for Cu interconnection (Korean)
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In:
Journal of the Korean Institute of Metals and Materials
;
45
, 5
;
300-304
;
2007
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ISSN:
- Article (Journal) / Print
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Title:Thermal stability of electrodeposited Ni-Re-P diffusion barrier for Cu interconnection
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Additional title:Wärmebeständigkeit von elektrolytischen Ni-Re-P-Diffusionsbarrieren für Kupferverbindungen
Titel koreanisch -
Contributors:
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Published in:Journal of the Korean Institute of Metals and Materials ; 45, 5 ; 300-304
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Publisher:
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Publication date:2007
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Size:5 Seiten, 6 Bilder, 2 Tabellen, 17 Quellen
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ISSN:
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Type of media:Article (Journal)
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Type of material:Print
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Language:Korean
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Keywords:
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Source:
Table of contents – Volume 45, Issue 5
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 269
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Aging behavior of high nitrogen austenitic stainless steelBang, Hae-Jung / Lee, Tae-Ho / Oh, Chang-Seok / Kim, Sung-Joon / Park, Ik-Min et al. | 2007
- 300
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Thermal stability of electrodeposited Ni-Re-P diffusion barrier for Cu interconnectionCho, Jin Ki / Kim, Moon Tae / Kang, Sung Goon et al. | 2007
- 305
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Measurements of resistance to pitting and crevice corrosion of stainless steels using electrochemical methodsMin, Sim-Kun / Lee, Jae-Bong et al. | 2007
- 315
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Cu-Ca alloy and thixoforming process design for high efficient rotorYi, Hyae-Kyung / Moon, Young-Hoon / Lee, Sang-Yong et al. | 2007
- 321
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Microstructure and mechanical properties of control rolled Fe-0.1C-(V,Nb) steelsPark, Inae / Kang, Namhyun / Kim, Suyoung / Lee, Youngjung / Cho, Kyung Mox et al. | 2007