A microcontroller-based neurostimulator in thick-film technology (English)
- New search for: Zaraska, Krzysztof
- New search for: Gröger, Barbara
- New search for: Zaraska, Krzysztof
- New search for: Gröger, Barbara
In:
EMPC, European Microelectronics and Packaging Conference & Exhibition, 16
;
87-91
;
2007
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ISBN:
- Conference paper / Print
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Title:A microcontroller-based neurostimulator in thick-film technology
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Additional title:Neurostimulator mit Mikrocontroller auf der Basis der Dickfilmtechnik
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Contributors:Zaraska, Krzysztof ( author ) / Gröger, Barbara ( author )
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Published in:
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Publisher:
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Publication date:2007
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Size:5 Seiten, 8 Bilder, 10 Quellen
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ISBN:
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Type of media:Conference paper
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Type of material:Print
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Language:English
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Keywords:
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Source:
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 19
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Embedded passives in multi-dielectric layer printed wiring board for IEEE 802.11a/b/g tri-mode dual-band wireless cardbus adapterTsai, Cheng-Hua / Chen, Chang-sheng / Wei, Chang-Lin / Chin, Kuo-Chiang / Chen, Wei-Ting / Shyu, Chin-Sun et al. | 2007
- 40
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Designing SMD lowpass filters in multilayer LTCC technologyKulke, R. / Möllenbeck, G. / Uhlig, P. / Maulwurf, K. / Rittweger, M. et al. | 2007
- 50
-
Improvement of the stability of laser trimmed micro resistors on LTCCDohle, Rainer G. / Schwanke, Dieter / Zötzl, Joachim et al. | 2007
- 87
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A microcontroller-based neurostimulator in thick-film technologyZaraska, Krzysztof / Gröger, Barbara et al. | 2007
- 110
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Printed antenna designsReitbauer, Roland / Midl, Manuela / Stocksreiter, Wolfgang et al. | 2007
- 116
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UBM structures for lead free solder bumping using C4NPRuhmer, Klaus / Laine, Eric / Hauck, Karin / Manessis, Dionysios / Ostmann, Andreas / Toepper, Michael et al. | 2007
- 122
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ECD wafer bumping and packaging for pixel detector applicationsFritzsch, Thomas / Jordan, Rafael / Ehrmann, Oswin / Reichl, Herbert et al. | 2007
- 128
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Interface reactions during Au-ball/wedge and AlSi1- wedge/wedge bonding at room temperatureSchneider-Ramelow, M. / Lang, K.D. / Geißler, U. / Scheel, W. / Reichl, H. et al. | 2007
- 134
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Surface acoustic wave component packagingFeiertag, G. / Krüger, H. / Bauer, C. et al. | 2007
- 139
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Low cost hybrid integration of laser diode on silicon PLC for optoelectronic applicationsMaggi, Luca / Canali, Arturo / Caccioli, Danilo / Preve, Gianni / Lorenzotti, Stefano et al. | 2007
- 149
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High resolution optical component technology for advanced novel encoder (Hi-OCTANE)Carr, John / Desmulliez, Marc P.Y. / Abraham, Eitan / Weston, Nick / McKendrick, David / Kidd, Matt / McFarland, Geoff / Meredith, Wyn / McKee, Andrew / Langton, Conrad et al. | 2007
- 155
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Multimode optical interconnections embedded in flexible electronicsBosman, E. / Steenberge, G. Van / Hendrickx, N. / Geernick, P. / Christiaens, W. / Vanfleteren, J. / Daele, P. van et al. | 2007
- 161
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Smart packaging of microlenses over a UV-LED arrayLuetzelschwab, Markus / Weiland, Dominik / Desmulliez, Marc P.Y. et al. | 2007
- 167
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High performance low-firing temperature thick-film pressure sensors on steelJacq, C. / Maeder, T. / Johner, N. / Corradini, G. / Ryser, P. et al. | 2007
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LTCC gas flow detectorJurkow, Dominik / Golonka, Leszek J. / Roguszczak, Henryk et al. | 2007
- 210
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Transmission line pulsing behavior of thin film resistorsBonfert, D. / Wolf, H. / Gieser, H. / Klink, G. / Svasta, P. et al. | 2007
- 229
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Additional stresses of ECA joints due to moisture induced swellingLöw, Richard C. / Miessner, Ralf / Wilde, Jürgen et al. | 2007
- 235
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Novel packaging technology for combo memory packagePekkanen, Ville / Mäntysalo, Matti / Miettinen, Jani / Mansikkamäki, Pauliina et al. | 2007
- 241
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- 247
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Towards low cost coupling structures for short-distance optical interconnectionsHendrickx, N. / Erps, J. van / Alajoki, T. / Destouches, N. / Blanc, D. / Franc, J. / Karioja, P. / Thienpont, H. / Daele, P. van et al. | 2007
- 253
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Surface mounted coupling elements for PCB embedded optical interconnectsKühner, Thomas / Schneider, Marc et al. | 2007
- 258
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Optical coupling and optoelectronics integration studied on demonstrator for optical interconnects on boardAlajoki, Teemu / Hendrickx, Nina / Erps, Jurgen Van / Obi, Samuel / Karppinen, Mikko / Thienpont, Hugo / Daele, Peter Van / Karioja, Pentti et al. | 2007
- 275
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Conductive adhesives for blue LEDsMizumura, Noritsuka / Ikarahi, Sen-ichi / Komagata, Michinori / Shirai, Yukio et al. | 2007
- 290
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Tunable dielectric material embedded in LTCC for GHz-frequency-range applicationsRentsch, Sven / Hu, Tao / Müller, J. / Stephan, R. / Hein, M. / Jantunen, H. et al. | 2007
- 294
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Vacuum package design for a MEMS based IR detector arrayOllila, J. / Toy, M.F. / Ferhanoglu, O. / Karioja, P. / Urey, H. et al. | 2007
- 298
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Capacitive micro force sensors manufactured with mineral sacrificial layersFournier, Y. / Wiedmer, S. / Maeder, T. / Ryser, P. et al. | 2007
- 304
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Cavity formation in a silicon cap wafer using aluminum etch-stop layerSosin, S. / Tian, J. / Bartek, M. et al. | 2007
- 314
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Reliability aspects of embedded chipsOstmann, A. / Manessis, D. / Cauwe, M. / Sommer, Johann-Peter et al. | 2007
- 329
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Lamination process studies for realisation of chip embedding technologies - current applications and technical challengesManessis, D. / Ostmann, A. / Yen, S.F. / Aschenbrenner, R. / Reichl, H. et al. | 2007
- 341
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Cost modelling for embedded component technologyBaets, J. de / Willems, G. / Ostmann, A. / Kriechbaum, A. / Kostner, H. et al. | 2007
- 364
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Application of metallo-organic pastes on LTCC substratesKita, Jaroslaw / Moos, Ralf et al. | 2007
- 375
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LTCC ultra high isostatic pressure sensorsMaeder, T. / Afra, B. / Fournier, Y. / Johner, N. / Ryser, P. et al. | 2007
- 381
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LTCC-based sensors for mechanical quantitiesPartsch, U. / Gebhardt, S. / Arndt, D. / Georgi, H. / Neubert, H. / Fleischer, D. / Gruchow, M. et al. | 2007
- 389
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Epoxy-based polymer for capacitive chemical sensorsMacek, Marijan / Klanjsek Gunde, Marta / Hauptmann, Nina et al. | 2007
- 394
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Observations on particle loaded silver inksCurrle, Ulrike / Krueger, Klaus et al. | 2007
- 404
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Reliability qualification of flexible printed circuitsDetert, Markus / Zerna, Thomas / Wolter, Klaus-Jürgen et al. | 2007
- 442
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Analysis methods for characterization of unleaded solderable surfacesHetschel, Thomas / Wolter, Klaus-Jürgen et al. | 2007
- 459
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Eco-design workflow processVasko, Cyril / Szendiuch, Ican / Schischke, Karsten et al. | 2007
- 463
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Prospects and yield of electrochemical wafer plating for bumping and signal routingDietrich, L. / Töpper, M. / Fritzsch, T. / Ehrmann, O. / Reichl, H. et al. | 2007
- 472
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Development of chip to antenna interconnections for contact-less smart card applicationsLenkkeri, Jaakko / Kivelä, Sari / Juntunen, Eceliina / Jaakola, Tuomo / Nummila, Kaj / Allen, Mark / Kaskiala, Toni / Hillmann, Gerhard / Mathewson, Alan et al. | 2007
- 484
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Second-level interconnect - "package to PCB" - future challenges and solutionsKabadi, Ashok N. et al. | 2007
- 495
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Design and technology considerations on LTCC microwave modules for fixed radio link equipmentPiloni, M. / Milani, A.G. et al. | 2007
- 500
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LTCC multilayer technology enables very compact 20 GHz switch unit for space applicationsDrüe, K.H. / Hein, M. / Müller, J. / Perrone, R. / Rentsch, S. / Stephan, R. / Trabert, J. et al. | 2007
- 505
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A new integrated waveguide antenna using multi-layer photo-imageable thick-film technologyHenry, M. / Sanz Iszquierdo, Benito / Free, Charles / Batchelor, John / Young, Paul et al. | 2007
- 510
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Microstrip and wave-guide SMT package up to 60 GHz (MWgSP)Buoli, Carlo / Bonato, Paolo / Negri, Luigi / Morgio, Fabio et al. | 2007
- 516
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Influences of the layout on the lifetime of direct copper bonding substrates (DCB)Günter, Michael / Wolter, Klaus-Jürgen et al. | 2007
- 522
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Advanced thin film substrates in Cu-AlN technologyFeurer, E. / Holl, B. / Vanselow, J. / Ruess, K. / Kaiser, A. et al. | 2007
- 526
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Laser soldering of LTCC hermetic packages with minimal thermal impactSeigneur, F. / Maeder, T. / Jacot, J. et al. | 2007
- 534
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Direct write technique used for solar cell fabricationHladik, J. / Barinka, R. / Szendiuch, I. et al. | 2007
- 546
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Fine line technology and panel plating - opposing directions, one solutionKenny, Stephen / Reents, Bert et al. | 2007
- 556
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Solvent resistance of silicones when used in electronic chemical cleaning environmentRiegler, Bill / Velderrain, Michelle / Duffer, Scott et al. | 2007
- 565
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Selected perovskite type LSFO thin films for the infrared detectorsLozinski, Andrzej / Wierzba, Pawel et al. | 2007
- 569
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Immersion tin wetting behaviour with lead-free solderingOezkoek, Mustafa / White, Nigel et al. | 2007
- 581
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ASPACT additive circuit transfer technologyHagberg, Juha / Kekonen, Teija / Kutilainen, Terho et al. | 2007
- 585
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Advanced electronics packaging via M(exp3)D direct writingHedges, Martin / King, Bruce / Renn, Mike et al. | 2007
- 590
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NanoCT: Visualizing of internal 3D-structures with submicron resolutionEgbert, Andre et al. | 2007
- 621
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Integration of thin flexible RF structures into flexible PCBChristiaens, W. / Burkhard, H. / Link, J. / Vanfleteren, J. et al. | 2007
- 627
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3D Chip Size Packaging for highly integrated memory cards for consumer-productsGötzen, Reiner / Reinhardt, Andrea / Bohlmann, Helge et al. | 2007
- 630
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Realization of large area stretchable electronic systems using lamination processesLoeher, Thomas / Manessis, Dionysios / Ostmann, Andreas / Reichl, Herbert et al. | 2007
- 635
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3DmicroTune: High-Q micromachined cavities for millimetre-wave filters and oscillatorsMills, J.B. / Giesbers, B. / Matters-Kammerer, M. / Ocket, I. / Nauwelaers, B. / Jourdain, A. / Gautier, W. / Schönlinner, B. et al. | 2007
- 640
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DAVID - a strategic research project for chip-scale MEMS/ASIC co-integrationMarenco, N. / Reinert, W. / Warnat, S. et al. | 2007
- 643
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3D package-on-package solution for next generation camerasSolberg, Vern / Humpston, Giles et al. | 2007
- 666
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3D-fluidic cooling structures in LTCCMach, M. / Müller, J. et al. | 2007
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High-brightness RGB LED modules based on alumina substrateHeikkinen, Veli / Juntunen, Eveliina / Kautio, Kari / Kemppainen, Antti / Korhonen, Pentti / Ollila, Jyrki / Sitomaniemi, Aila / Kemppainen, Timo / Korkala, Heikki / Kutilainen, Terho et al. | 2007
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Novel diamond Al and diamond Cu compositesLanglade, Renaud de / Seleznev, Maxim et al. | 2007
- 687
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Packaging concepts for neuroprosthetic implantsTöpper, M. / Klein, M. / Wilke, M. / Oppermann, H. / Kim, S. / Tathireddy, P. / Solzbacher, F. / Reichl, H. et al. | 2007
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Packaging of an implantable accelerometer for measurements of heart motionImenes, Kristin / Aasmundtveit, Knut / Husa, Ellen M. / Högetveit, Jan Olav / Halvorsen, Steinar / Elle, Ole Jakob / Fosse, Erik / Hoff, Lars et al. | 2007
- 703
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- 723
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