Cap layer and grain size effects on electromigration reliability in Cu/low-k interconnects (English)
- New search for: Zhang, L.
- New search for: Kraatz, M.
- New search for: Aubel, O.
- New search for: Hennesthal, C.
- New search for: Im, J.
- New search for: Zschech, E.
- New search for: Ho, P.S.
- New search for: Zhang, L.
- New search for: Kraatz, M.
- New search for: Aubel, O.
- New search for: Hennesthal, C.
- New search for: Im, J.
- New search for: Zschech, E.
- New search for: Ho, P.S.
In:
IITC, IEEE International Interconnect Technology Conference, 2010
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1-3
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2010
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ISBN:
- Conference paper / Print
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Title:Cap layer and grain size effects on electromigration reliability in Cu/low-k interconnects
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Contributors:Zhang, L. ( author ) / Kraatz, M. ( author ) / Aubel, O. ( author ) / Hennesthal, C. ( author ) / Im, J. ( author ) / Zschech, E. ( author ) / Ho, P.S. ( author )
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Published in:
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Publisher:
- New search for: IEEE Operations Center
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Place of publication:Piscataway
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Publication date:2010
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Size:3 Seiten, 13 Quellen
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ISBN:
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DOI:
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Type of media:Conference paper
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Type of material:Print
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Language:English
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Keywords:
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Source:
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
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- 1
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Cap layer and grain size effects on electromigration reliability in Cu/low-k interconnectsZhang, L. / Kraatz, M. / Aubel, O. / Hennesthal, C. / Im, J. / Zschech, E. / Ho, P.S. et al. | 2010
- 1
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The Improvement of Electrical Programmable Fuse with Salicide-Block Dielectric Film in 40nm CMOS TechnologyWu, Kuei-Sheng / Wong, Chang-Chien / Chi, Sinclair / Tseng, Ching-Hsiang / Huang, Purple / Huang, Devon / Su, Titan et al. | 2010
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