Electromagnetic interference (EMI) shielding of thin graphite/epoxy composite plates (English)
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In:
Critical Materials and Processes in a Changing World, International SAMPE Electronics Conference, 6
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6
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82-94
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1992
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ISBN:
- Conference paper / Print
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Title:Electromagnetic interference (EMI) shielding of thin graphite/epoxy composite plates
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Additional title:Elektromagnetische Interferenz-Abschirmung (EMI) von dünnen Graphit/Epoxid-Verbundplatten
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Contributors:
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Published in:
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Publisher:
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Place of publication:Covina
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Publication date:1992
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Size:13 Seiten, 7 Bilder, 1 Tabelle, 6 Quellen
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ISBN:
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Type of media:Conference paper
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Type of material:Print
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Language:English
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Keywords:
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Source:
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 1
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Cure management of benzocyclobutene dielectric for electronic applicationsDibbs, M.G. / Townsend, P.H. / Stokich, T.M. / Huber, B.S. / Mohler, C.E. / Heistand, R.H. / Garron, P.E. et al. | 1992
- 13
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Metal-phthalocyanine thin films for silicon barrier diodesBunday, B.D. / Tomar, M.S. et al. | 1992
- 20
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Hydrogen in hydrogenated amorphous silicon thick film and its relation to the photoresponse of the film in contact with molybdenumSridhar, N. / Chung, D.D.L. / Anderson, W.A. / Coleman, J. et al. | 1992
- 42
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Nondestructive method for imaging the defects in gallium arsenide substratesWinter, J.M. / Green, R.E. et al. | 1992
- 54
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Acoustic microscopy of electronic materials and devicesFerrell, W.M. / Djordjevic, B.B. et al. | 1992
- 69
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Analyses of the techniques for fiber-matrix bond strength measurementChiang, M.Y.M. / Herrera-Franco, P.J. et al. | 1992
- 82
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Electromagnetic interference (EMI) shielding of thin graphite/epoxy composite platesRoberts, J.C. / Wienhold, P.D. / Kirkbridge, D.L. et al. | 1992
- 146
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Dielectric properties of polymer matrix composites prepared from conductive polymer treated fabricsSengupta, L.C. / Spurgeon, W.A. et al. | 1992
- 165
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Alternatives to CFC-solvent based cleaning for PCBs: which options are industry participants choosing?Fox, S.J. et al. | 1992
- 220
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Use of ceramics in electronic packagingHargis, B. / Weidner, K. et al. | 1992
- 233
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Current trends in encapsulation processes and equipment for molded plastic semiconductor devicesHull, J.L. et al. | 1992
- 243
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Chip protection with glob top encapsulationBurkhart, A. et al. | 1992
- 256
-
Mechanisms of microelectronics protection with polysiloxane polymersFabianowski, W. / Jaffe, D. / Jaccodine, R.J. et al. | 1992
- 275
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Application of a new elastomer for adhesive of PWBSato, H. / Matsunaga, T. et al. | 1992
- 285
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The application of MMC as microwave packagingOkumura, M. / Koga, Y. / Ito, T. / Yoshizaki, K. / Yamashita, H. / Fujiwara, T. et al. | 1992
- 295
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Preform based metal matrix composite fabrication for electronic carrier applicationsHornor, J.A. / Hannon, G.e. et al. | 1992
- 308
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Manufacture and test of advanced composite standard electronic modulesGlatz, J. / Whatley, W. / Hook, M. et al. | 1992
- 320
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Electronic packaging using combined metal matrix composites and diamond film materialsMorgan, R.E. / Ehlers, S.L. / Sosniak, J. et al. | 1992
- 334
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Applications of advanced composites for satellite packaging for improved electronic component thermal managementGlatz, J.J. / Vrable, D.L. / Schnedake, T. / Johnson, C. et al. | 1992
- 347
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A comparison of common MCM-D dielectric material performanceTessier, T.G. et al. | 1992
- 358
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High speed digital circuits on low stress, thin film, polyimide, multichip modulesFrancomacaro, A.S. / Clatterbaugh, G.V. / Blum, N.A. et al. | 1992
- 371
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Use of CVD diamond substrates in electronic applicationsBorchelt, E.F. / Lu, G. et al. | 1992
- 406
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Process improvements for low noise amplifiersKnoot, P.A. / Horner, R.J. / Patterson, W.C. et al. | 1992
- 417
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Production and performance of flip chip mounted gallium arsenide MMICSGulick, J.J. / Woolridge, J.J. et al. | 1992
- 428
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Liquid crystal polymer film and sheet new options for the electronics industryJester, R.D. et al. | 1992
- 437
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Mechanical and electrical properties of nonwoven aramid reinforced composites for electronicsZussman, M.P. / Kirayoglu, B. / Sharkey, S. / Powell, D.J. et al. | 1992
- 449
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Microelectronic devices based on conductive polymersSaunders, H.E. / Schoch, K.F. et al. | 1992
- 466
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Elastomeric enhancement of low stress properties of epoxy molding compounds for I.C. encapsulation applicationsIyer, S.R. / Dangayach, K.C.B. / Abrego, L. et al. | 1992
- 485
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The electrical characterization of multichip module materialsAmey, D.J. / Curilla, J.P. / Gates, D. et al. | 1992
- 500
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Effects of processing conditions on a UV curable, flip chip adhesiveChung J. Lee / Sherman, K. et al. | 1992
- 508
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Recent advances in the application of high performance siloxanes polymers in electronic packagingWong, C.P. et al. | 1992
- 528
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Elastic polysiloxane thin films obtained from plasma polymerizationKrishnan, A. / Chung J. Lee / Kumar, N. et al. | 1992
- 547
-
Development of composite materials for electronic packaging applicationsKinna, M. et al. | 1992
- 556
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Fabrication, testing, and evaluation of high-thermal-conductivity, lightweight polymer composites reinforced with pitch-graphite fibers as heat sinks for high-density packaging applicationsIbrahim, A.M. et al. | 1992
- 630
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Additive process for fabricating high density printed circuit boardsKing, D.R. et al. | 1992
- 652
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Greatly enhancing the electrical conductivity of short metal-coated carbon fiber polymer-matrix composite by the addition of a small proportion of metal particles which melted during composite fabricationLin, Li / Pay Yih / Chung, D.D.L. et al. | 1992
- 659
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New choices for electronic packaging materialsMattox, D.M. et al. | 1992
- 672
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Characterization of oxide formed on silicon by exposure to atomic oxygen in spaceSengupta, L.C. / Brodkin, J.S. / Franzen, W. / Sagalyn, P.L. et al. | 1992
- 699
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Dimensional control in cofired glass-ceramic multilayersMikeska, K.R. / Mason, R.C. et al. | 1992
- 713
-
Delineation methods for polycrystalline diamond filmEdwards, L.M. / Davidson, J.L. et al. | 1992
- 782
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Composite materials in electronic packagingDasgupta, A. et al. | 1992
- 795
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Optimization of MBE gallium arsenide on silicon for optical interconnectsPanayotatos, P. et al. | 1992
- 808
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The technology and reliability of laser processed heterostructure devicesChristou, A. et al. | 1992
- 816
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High performance InGaAs on silicon MSM photodetectors grown by MBEIliadis, A.A. / Papanicolaou, N. / Christou, A. / Anderson, G.W. et al. | 1992
- 823
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Stresses and alloy mixing in Si(1-x)Ge(x)/Si superlatticesProkes, S.M. et al. | 1992