Influence of different polishing parameters on sapphire substrate CMP (English)
- New search for: Niu, Xinhuan
- New search for: Zhao, Xin
- New search for: Yin, Da
- New search for: Wang, Jianchao
- New search for: Wang, Chenwei
- New search for: Niu, Xinhuan
- New search for: Zhao, Xin
- New search for: Yin, Da
- New search for: Wang, Jianchao
- New search for: Wang, Chenwei
In:
ICPT 2017
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6
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2017
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ISBN:
- Conference paper / Electronic Resource
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Title:Influence of different polishing parameters on sapphire substrate CMP
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Contributors:Niu, Xinhuan ( author ) / Zhao, Xin ( author ) / Yin, Da ( author ) / Wang, Jianchao ( author ) / Wang, Chenwei ( author )
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Conference:ICPT 2017 - International Conference on Planarization/CMP Technology ; 2017 ; Leuven, Belgium
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Published in:ICPT 2017 ; 6
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Publisher:
- New search for: VDE VERLAG GMBH
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Publication date:2017-01-01
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Size:6 pages
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ISBN:
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Type of media:Conference paper
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Type of material:Electronic Resource
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Language:English
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Source:
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
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STI CMP Endpoint Robustness Improvement through Stribeck Curve StudyPerrot, C. / Bouis, R. / Daventure, N. / Euvrard, C. / Balan, V. et al. | 2017
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Stabilization of removal rate of silica glass on catalystreferred etching by cleaning catalyst surfaceNakahira, Yuta / Isohashi, Ai / Inada, Tatsuaki / Toh, Daisetsu / Kida, Hideka / Matsuyama, Satoshi / Sano, Yasuhisa / Yamauchi, Kazuto et al. | 2017
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Controllable CMP of Oxide Film by Using Colloidal Ceria SlurryKurokawa, Syuhei / Toyama, Takaaki / Hayashi, Terutake / Suda, Eisaku / Tokuda, Jun et al. | 2017
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Surface Flatness and Roughness Synchronized Control in CMP Process of Silicon MirrorJiang, Bocheng / Zhao, Dewen / Lu, Xinchun et al. | 2017
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Investigations of Annealing Effect on TSV CMPRao, Can / Wang, Tongqing / Cheng, Jie / Liu, Yuhong / Lu, Xinchun et al. | 2017
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Development of Modularized Electrode in Electro-Kinetic Force Assisted Chemical Mechanical Planarization for Through-Silicon-Via Wafer PlanarizationChen, Chao-Chang A. / Xue, Min-Yue / Lin, Yu-Ming / Pu, Wei-Chin W. et al. | 2017
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In situ imaging of local corrosion cells on copper fine wires in solutionsTakatoh, Chikako / Ogata, Shoichiro / Kitagawa, Takuya / Okamoto, Takahiro et al. | 2017
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BEoL post CMP cleaning challenges for 22 nm FD-SOI and beyondKoch, Johannes / Rehschuh, Stephan / Gerlich, Lukas / Dhavamani, Abitha / Steinke, Philipp / Krause, Robert / Naue, Johannes / Bott, Sascha / Vasilev, Boris / Breuer, Dirk et al. | 2017
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In-line Atomic Resolution Local Nanotopography Variation Metrology for CMP ProcessKim, Tae-Gon / Heylen, Nancy / Kim, Soon-Wook / Vandeweyer, Tom / Jo, Ah-Jin / Lee, Ju Suk / Ahn, Byoung-Woon / Cho, Sang-Joon / Park, Sang-il / Irmer, Bernd et al. | 2017
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CMP Process for Wafer Backside PlanarizationKrueger, Andreas / Lisker, Marco / Trusch, Andreas / Mai, Andreas et al. | 2017
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In-line Real-time Conductivity Technique for Monitoring of Liquid Chemical Concentration during Semiconductor ManufacturingJie, Hong / Kulkarni, Atul / Kim, Hyeong-U / Kim, Taesung et al. | 2017
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A Study of Cu inhibitor removal by alkaline agent in post CMP cleaning processGao, Baohong / Tan, Baimei / Liu, Yuling et al. | 2017
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Study on Fullerenol as the Additive to Remove BTA Film Remaining on Copper Surface in Chemical Mechanical Polishing ProcessTsai, Yueh Hsun / Suzuki, Keisuke / Chen, Chao-Chang A. et al. | 2017
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Atomic Insights into Material Removal Mechanisms in Si and Cu Chemical Mechanical Polishing Processes: ReaxFF Reactive Molecular Dynamics SimulationsWen, Jialin / Ma, Tianbao / Lu, Xinchun / Zhang, Weiwei / van Duin, Adri C.T. et al. | 2017
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Study on the mechanisms of Si fine polishing with water-soluble polymerHe, Yangang et al. | 2017
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Evaluation of Polyurethane Pads Properties for Effective Use in Planarization ProcessChung, Hyunjae / Shin, Cheolmin / Jin, Yinhua / Kim, Taesung et al. | 2017
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Effect of Guanidine Sulfate on the CMP of Ru in H2O2 Based SlurryYang, Guang / He, Peng / Qu, Xin-Ping et al. | 2017
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Investigation of Mass Transfer Speed Theory on chemical mechanical polishingLiu, Yuling / Li, Yanlei / Wang, Chenwei / Yang, Liu / Wang, Jianchao et al. | 2017
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High-efficiency Planarization of GaN Wefers by Catalyst-Referred Etching Employing Photoelectrochemical OxdationKida, Hideka / Isohashi, Ai / Inada, Tatsuaki / Matsuyama, Satoshi / Sano, Yasuhisa / Yamauchi, Kazuto et al. | 2017
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Post-CMP Cleaners for Tungsten Advanced Nodes: 10 nm and 7 nmLieten, Ruben R. / White, Daniela / Parson, Thomas / Jenq, Shining / Frye, Don / White, Michael / Teugels, Lieve / Struyf, Herbert et al. | 2017
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The effect of surface charge using amino acid and cationic surfactant for high material removal rate (MRR)Sun, Hanna / Kim, Ye-Chan / Park, In-Kyung / Nam, Jae-Da et al. | 2017
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Preparation of Ordered Mesoporous Si02/Mc N anocomposite Abrasives and Their Chemical Polishing Behavior on Fused Silicon SubstratesLi , Xu / Chunli, Zou / Xin, Zhang / Chengxi, Kang / Guihai, Luo / Guoshun, Pan et al. | 2017
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Improvement of Ruthenium Polishing Rate by Addition of Guanidinium IonsWang, Chenwei / Du, Yichen / Zhou, Jianwei / Liu, Yuling et al. | 2017
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Measurement of Removal Force in DI-Water for Fine Particles with Sub-nanoNewton ResolutionShima, Shohei / Hamada, Satomi / Takatoh, Chikako / Wada, Yutaka / Fukunaga, Akira / Sobukawa, Hiroshi et al. | 2017
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Stabilization method of transition metal catalyst for high efficiency catalyst-referred etching (CARE) of silicon carbideToh, Daisetsu / Isohashi, Ai / Inada, Tatuaki / Nakahira, Yuta / Kida, Hideka / Matuyama, Satoshi / Sano, Yasuhisa / Yamauchi, Kazuto et al. | 2017
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Application of Slurry Injection System (SIS) to Advanced Deep-Trench (DT) CMPJha, Amarnath / Stoll, Derek / Tseng, Wei-Tsu / Wu, Changhong / Yang, Ji Chul / Philipossian, Ara et al. | 2017
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Device pattern impact on optical endpoint detection by interferometry for STI CMPBourzgui, S. / Roussy, A. / Georges, G. / Faivre, E. / Labory, K. / Allard, A. et al. | 2017
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Development of Post InGaAs CMP Cleaning Process for sub 10nm Device ApplicationPurushothaman, Muthukrishnan / Choi, In-chan / Kim, Hyun-Tae / Teugels, Lieve / Kim, Tae-Gon / Park, Jin-Goo et al. | 2017
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Novel Copper Barrier Slurry for Advanced Cu CMP ProcessChao, Lucas / Hung, Steve / Huang, Tommy / Chou, Julia / Yang, William / Luo, Michael / Kuo, Wendy et al. | 2017
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Observation of the real contact area between PVA brush and surface using polarization plate and evanescent fieldHanai, Masanao / Sanada, Toshiyuki / Fukunaga, Akira / Hiyama, Hirokuni et al. | 2017
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Optimization of Cu Corrosion Inhibitor Concentration to Reduce Organic DefectsCho, Byoung-Jun / Pyun, Hae-Jung / Shima, Shohei / Hamada, Satomi / Hiyama, Hirokuni / Park, Jin-Goo et al. | 2017
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Influence of different polishing parameters on sapphire substrate CMPNiu, Xinhuan / Zhao, Xin / Yin, Da / Wang, Jianchao / Wang, Chenwei et al. | 2017
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Carbon Compound Particle Residue Defect Remove by CMP Post CleanChen, Shih-Hsi / Yen, Shih-Ci / Chen, Ming-Hsiang / Chen, Ming-Hong / Liu, Chiao-Wei et al. | 2017
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Effect of Al2O3 and SiO2 Abrasives on the CMP of Molybdenum using Different Polishing ParametersKalantzis, Panagiotis / Teugels, Lieve / De Gendt, Stefan et al. | 2017
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Chemical Mechanical Polishing of SiC Substrate Using Enhanced Slurry Containing Nanobubbles with Active Gas Generated by PlasmaMizuuchi, Shinya / Uneda, Michio / Shibuya, Kazutaka et al. | 2017
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The Behaviours of BTA and SDS in the Alkaline Slurry during the Backside CMP of Heterogeneous Microstructure of TSV WafersWang, BingQuan / Liu, YuHong / Lu, XinChun et al. | 2017
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Cu Barrier Metal Slurry for Reducing Defect-Level and Enhancing Removal PerformancesHong, Seungchul / Lim, Jinhyuk / Kang, Hyungoo / Jin, Gyuan / Kim, Byoungsoo / Lee, Seunghyun / Kim, Youngho et al. | 2017
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Highly Efficient Cleaning Formulations for Removing Ceria Slurry Residues in Post-CMP ApplicationsBernatis, Paul / Lin, Jhih-Fong / Tai, Pei-Yu / Lin, Yi-Han / Bai, Chia-Hui / Tseng, Yi-Hao / Kuroda, Akira / Yen, Chi et al. | 2017
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Corrosion inhibition of Cobalt during post-Chemical Mechanical Planarization CleaningShibata, Toshiaki / Kusano, Tomohiro / Harada, Ken / Takeshita, Kan / Kawase, Yasuhiro et al. | 2017
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Effect of colloidal silica particles on subsurface damage of fused silica optics during CMP processChunli, Zou / Li, Xu / Chengxi, Kang / Xin, Zhang / Guoshun, Pan et al. | 2017
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Effect of Corrosion Inhibitor and Non-ionic Surfactant on CMP of Cu/Co Barrier StackJiang, Liang / He, Yongyong / Qian, Linmao et al. | 2017
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Modified Kinematic Model for Predicting Contact Points of Conditioner in CMPChoi, Jihye / Kim, Eungcher / Shin, Cheolmin / Jin, Yinhua / Kim, Taesung et al. | 2017
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Research on Multi-Method Endpoint Detection in Chemical Mechanical Planarization ProcessLi, Hongkai / Lu, Xinchun / Luo, Jianbin et al. | 2017
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Study on effect of different complexing agents and inhibitors on Co corrosion in H2O2 based alkaline solution by EQCMHe, Peng / Yang, Guang / Qu, Xin-Ping et al. | 2017
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Chemo-Mechanical Planarization of Germanium Using Potassium Periodate based Titania SlurriesGupta, Apeksha / Victoria, S. Noyel / Manivannan, R. et al. | 2017
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Development of Novel Cleaning Solution for Post Chemical Mechanical Planarization Silicon WaferSong, Junghwan / Han, Na / Park, Kihong / Yi, Sokho / Kim, Taesung et al. | 2017
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W CMP Tiny Particle Reduction SolutionLi,Kun / Wang, Tongqing / Zheng, Shumao / Lu, Xinchun et al. | 2017
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CMP Process for (110)-Germanium Roughness ReductionLisker, Marco / Krueger, Andreas / Lupina, Grzegorz / Yamamoto, Yuji / Mai, Andreas et al. | 2017
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Dummy Gate Amorphous Silicon CMP Using In-situ Profile CLC Endpoint System for Advanced FinFETTsvetanova, Diana / Iizumi, Takeshi / Ito, Ban / Royere, Gael / Durix, Fabien / Devriendt, Katia / Ong, Patrick / Struyf, Herbert et al. | 2017
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Torque measurements generated by a rotating PVA brush without a skin layerIto, Masayoshi Jr. / Sanada, Toshiyuki / Fukunaga, Akira / Hiyama, Hirokuni et al. | 2017
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Electrochemical study of SiGe in different alkaline chemical formulationsYang, Shenghua / Zhang, Baoguo / Liu, Yuling / Wang, Chenwei et al. | 2017
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Effect of Deposition Methods on Material Removal Rate During Nickel CMPWang, Yanni / Teugels, Lieve / Vandersmissen, Kevin / De Gendt, Stefan / Krishnan, Sitaraman / Struyf, Herbert et al. | 2017
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Density Evaluation of Sub-100 nm Particles by Using EllipsometryKondoh, Eiichi / Suzuki, Katsuya / Jin, Lianhua / Hamada, Satomi / Shima, Shohei / Hiyama, Hirokuni et al. | 2017
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Chemical Generation Mechanism of Copper Flakes on Copper Wafer Surface from CMP Slurry and Post CMP Cleaning ChemistryCho, Byoung-Jun / Paluvai, Nagarjuna R. / Purushothaman, Muthukrishanan / Lee, Jung-Hwan / Shima, Shohei / Hiyama, Hirokuni / Park, Jin-Goo et al. | 2017
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Application of Machine Learning and Neural Networks for Generation of Pre-CMP Profiles of Advanced Deposition Processes for CMP ModelingGhulghazaryan, Ruben / Wilson, Jeff et al. | 2017
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Inline Refractive Index Replaces Auto-titration in Qualifying H2O2 Concentration in CMP of TungstenUrquhart, Karl / Johnston, Robert / Kavaljer, Marcus et al. | 2017
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Development of Advanced CMP Process for the Minimization of Hydrophobic Interaction based on the Surface Treatment TechnologyKim, Hyuk-Min / Heo, Jee-Hwan / Kang, Jung-Eun / Park, Seung-Ho / Park, Jong-Hyuk / Yoon, Il-Young / Yoon, Bo-Un / Nam, Seok-Woo et al. | 2017
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Innovative CMP Solution for Advanced STI ProcessPan, Ji Gang / Hung, Steve / Zhang, Qiao Feng / Lu, Chen / Cao, Yi / Qian, Bainian / Su, Elton / Yang, William et al. | 2017
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The Numerical Investigation of the Effect of Withdrawing Velocity on Marangoni Drying Performance in the Post CMP CleaningLi, Changkun / Zhao, Dewen / Lu, Xinchun et al. | 2017
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Proposal of Spraying Pure Water Method under the Electric Field and Its Behavior Observation in the Cleaning Process of CMPFujimoto, Masanori / Uneda, Michio et al. | 2017
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Optimization of WC-Co Composition for CVD Diamond Pad ConditionerKim, Myeong-Jun / Ryu, Heon-Yul / Lee, Jung-Hwan / Kim, Ji-Woo / Cho, Sooji / Hyun, Dabin / Jee, Hae-geun / Park, Jin-Goo et al. | 2017
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Advanced Optical Particle Sizing for Non-Invasive Slurry analysisMavliev, Rashid et al. | 2017
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Improvement of Material Removal Efficiency by Optimization of Anisotropic Contact of Pad AsperitiesSuzuki, Norikazu / Oshika, Shingo / Misono, Hirotaka / Hashimoto, Yohei / Yasuda, Hozumi / Mochizuki, Yoshihiro et al. | 2017
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Novel Method for Nano-Surface Analysis of Cu CMP Chemicals by AFM and Microfluidic Chip SystemRyu, Heon-Yul / Han, Kwang-Min / Cho, Byoung-Jun / Shima, Shohei / Hamada, Satomi / Hiyama, Hirokuni / Kim, Tae-Gon / Park, Jin-Goo et al. | 2017
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Cherishing Old Knowledge, Acquiring New - Past, Present and Future of CMP TechnologyTsujimura, Manabu et al. | 2017
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Planarization of SiC wafer using photo-catalyst incorporated padZhou, Yan / Pan, Guoshun / Zou, Chunli / Luo, Guihai / Luo, Haimei et al. | 2017
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Control of Silica Particle Deposition for Fabrication of Post CMP Cleaning Ability Evaluation WaferCho, Younsun / Chae, Seung-Ki / Shin, Cheolmin / Jin, Yinhua / Kim, Taesung et al. | 2017
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Evaluation of Competitive Reaction of Various Cu CMP Slurry ComponentsHan, Kwang-Min / Cho, Byoung-Jun / Lee, Jung-Hwan / Ryu, Heon-Yul / Shima, Shohei / Hamada, Satomi / Hiyama, Hirokuni / Park, Jin-Goo et al. | 2017
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Pad Conditioning for Poromeric MaterialsScott Lawing, Andrew et al. | 2017
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Effect of Flow Rate and Concentration on Filtration Efficiency of Colloidal AbrasivesWu, Mia / Lee, James / Wang, Henry / Hsiao, Steven / Shie, Bob / Yang, HJ et al. | 2017
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Study on the Grit Angle of Single Diamond Dressing on CMP PadsChen, Chao-Chang Arthur / Yi-Ting / Li, Tzu-Hao / Hiyama, Hirokuni / Wada, Yutaka / Shiu, Pei-Jiun Ricky / Kimura, Keiichi et al. | 2017
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A study of CMP Edge Profile for Production WafersIsobe, Akira et al. | 2017
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The Effect of chelating Agent in TMAH Based Post Cu-CMP Cleaning SolutionJeon, Seongsik / Jeon, Sanghyuk / Lim, Ahhyeon / Yi, Sokho / Kim, Taesung et al. | 2017