3D and Microprocessors (English)
- New search for: Morrow, Pat
- New search for: Muthukumar, Sriram
- New search for: Garrou, Philip
- New search for: Bower, Christopher
- New search for: Ramm, Peter
- New search for: Morrow, Pat
- New search for: Muthukumar, Sriram
In:
Handbook of 3D Integration
: Technology and Applications of 3D Integrated Circuits
;
651-674
;
2008
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ISBN:
- Article/Chapter (Book) / Electronic Resource
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Title:3D and Microprocessors
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Contributors:Garrou, Philip ( editor ) / Bower, Christopher ( editor ) / Ramm, Peter ( editor ) / Morrow, Pat ( author ) / Muthukumar, Sriram ( author )
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Published in:Handbook of 3D Integration : Technology and Applications of 3D Integrated Circuits ; 651-674
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Publisher:
- New search for: Wiley‐VCH Verlag GmbH & Co. KGaA
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Place of publication:Weinheim, Germany
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Publication date:2008-08-06
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Size:23 pages
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ISBN:
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DOI:
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Type of media:Article/Chapter (Book)
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Type of material:Electronic Resource
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Language:English
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Keywords:
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Source:
Table of contents eBook
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 1
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Introduction to 3D IntegrationGarrou, Philip et al. | 2008
- 13
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Drivers for 3D IntegrationGarrou, Philip / Vitkavage, Susan / Arkalgud, Sitaram et al. | 2008
- 25
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Overview of 3D Integration Process TechnologyGarrou, Philip / Bower, Christopher et al. | 2008
- 45
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Deep Reactive Ion Etching of Through Silicon ViasRoozeboom, Fred / Blauw, Michiel A. / Lamy, Yann / van Grunsven, Eric / Dekkers, Wouter / Verhoeven, Jan F. / van den Heuvel, Eric(F.) / van der Drift, Emile / Kessels, Erwin (W. M. M.) / van de Sanden, Richard (M. C. M.) et al. | 2008
- 93
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Laser AblationLo, Wei‐Chung / Chang, S. M. et al. | 2008
- 107
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SiO2Wieland, Robert et al. | 2008
- 121
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Insulation – Organic DielectricsGarrou, Philip / Bower, Christopher et al. | 2008
- 133
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Copper PlatingRitzdorf, Tom / Beica, Rozalia / Sharbono, Charles et al. | 2008
- 157
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Metallization by Chemical Vapor Deposition of W and CuKlumpp, Armin / Wieland, Robert / Ecke, Ramona / Schulz, Stefan E. et al. | 2008
- 175
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Fabrication, Processing and Singulation of Thin WafersKröninger, Werner et al. | 2008
- 209
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Overview of Bonding Technologies for 3D IntegrationJoly, Jean‐Pierre et al. | 2008
- 223
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Chip‐to‐Wafer and Wafer‐to‐Wafer Integration SchemesMatthias, Thorsten / Pargfrieder, Stefan / Wimplinger, Markus / Lindner, Paul et al. | 2008
- 249
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Polymer Adhesive Bonding TechnologyLu, James Jian‐Qiang / Cale, Tim S. / Gutmann, Ronald J. et al. | 2008
- 261
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Bonding with Intermetallic CompoundsKlumpp, Armin et al. | 2008
- 271
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Commercial ActivityGarrou, Philip et al. | 2008
- 289
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Wafer‐Level 3D System IntegrationRamm, Peter / Wolf, M. Jürgen / Wunderle, Bernhard et al. | 2008
- 319
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Interconnect Process at the University of ArkansasBurkett, Susan / Schaper, Leonard et al. | 2008
- 339
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Vertical Interconnection by ASETTakahashi, Kenji / Tanida, Kazumasa et al. | 2008
- 375
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3D Integration at CEA‐LETICharlet, Barbara / Di Cioccio, Lèa / Leduc, Patrick / Henry, David et al. | 2008
- 393
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Lincoln Laboratory's 3D Circuit Integration TechnologyBurns, James / Aull, Brian / Berger, Robert / Checka, Nisha / Chen, Chang‐Lee / Chen, Chenson / Gouker, Pascale / Keast, Craig / Knecht, Jeffrey / Soares, Antonio et al. | 2008
- 413
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3D Integration Technologies at IMECBeyne, Eric et al. | 2008
- 431
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Fabrication Using Copper Thermo‐Compression Bonding at MITTan, Chuan Seng / Fan, Andy / Reif, Rafael et al. | 2008
- 447
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Rensselaer 3D Integration ProcessesLu, James Jian‐Qiang. / Cale, Tim S. / Gutmann, Ronald J. et al. | 2008
- 463
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3D Integration at Tezzaron Semiconductor CorporationPatti, Robert et al. | 2008
- 487
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3D Integration at Ziptronix, Inc.Enquist, Paul et al. | 2008
- 505
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3D Integration ZyCubeMotoyoshi, Makoto et al. | 2008
- 517
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Design for 3D Integration at North Carolina State UniversityFranzon, Paul D. et al. | 2008
- 529
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Modeling Approaches and Design Methods for 3D System DesignSchneider, Peter / Elst, Günter et al. | 2008
- 575
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Multiproject Circuit Design and Layout in Lincoln Laboratory's 3D TechnologyBurns, James / Berger, Robert / Checka, Nisha / Keast, Craig / Tyrrell, Brian / Wheeler, Bruce et al. | 2008
- 583
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Computer‐Aided Design for 3D Circuits at the University of MinnesotaSapatnekar, Sachin S. et al. | 2008
- 599
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Electrical Performance of 3D CircuitsHeittmann, Arne / Ramacher, Ulrich et al. | 2008
- 623
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Testing of 3D CircuitsMak, T. M. et al. | 2008
- 635
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Thermal Management of Vertically Integrated PackagesBrunschwiler, Thomas / Michel, Bruno et al. | 2008
- 651
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3D and MicroprocessorsMorrow, Pat / Muthukumar, Sriram et al. | 2008
- 675
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3D MemoriesTuttle, Mark et al. | 2008
- 689
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3D Read‐Out Integrated Circuits for Advanced Sensor ArraysBower, Christopher et al. | 2008
- 703
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Power Devicesde Samber, Marc / van Grunsven, Eric / Heyes, David et al. | 2008
- 723
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Wireless Sensor Systems – The e‐CUBES ProjectIonescu, Adrian M. / Beyne, Eric / Hilt, Tierry / Herndl, Thomas / Nicole, Pierre / Sanduleanu, Mihai / Sauer, Anton / Shea, Herbert / Taklo, Maaike / Van Veen, Co et al. | 2008
- 747
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Conclusions| 2008
- 749
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Index| 2008
- I
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Front Matter| 2008