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A New Method for In-Line Measurement of the Dielectric Constant of Low-k Films
British Library Conference Proceedings | 2003| -
Influence of Si Substrate Ground on Antenna Transmission Gain for On-Chip Wireless Interconnects
British Library Conference Proceedings | 2003| -
Process Challenges for Integrating Copper With SiLK Dielectric
British Library Conference Proceedings | 2003| -
Productization of Cu/Low-k at the 130 and 90 nm Technology Nodes
British Library Conference Proceedings | 2003| -
Enhancement of Contact Filling Characteristics in CVD-Al Metallization With Plasma-Treated MOCVD-TiN Wetting Layer
British Library Conference Proceedings | 2003| -
Derivation of Film Characteristics and Prediction of Electromigration Failure in Passivated Polycrystalline Line
British Library Conference Proceedings | 2003| -
Fundamentals and Improvements of Line-to-Line Breakdown Reliability in Copper Damascene Process
British Library Conference Proceedings | 2003| -
Scaling Rule for Electromigration in Cu Dual-Damascene Interconnects on W
British Library Conference Proceedings | 2003| -
An Imprint-Damascene Process for Cu/Low-k Interconnects
British Library Conference Proceedings | 2003| -
Demonstration of Dual Damascene 0.18 mum Cu/Black Diamond Integration
British Library Conference Proceedings | 2003| -
Modified Silica Xerogel as a Low-k Dielectric With Improved Mechanical Properties
British Library Conference Proceedings | 2003| -
In Situ Cleaning Solution to High Via Resistance Issue on Floating Metal Pattern
British Library Conference Proceedings | 2003| -
Integration of CVD Cu Seed With CVD Cu Barrier for Dual Damascene Cu Metallization
British Library Conference Proceedings | 2003| -
Pattern Density Effects on Film Profile Evolution During ECD
British Library Conference Proceedings | 2003| -
The Numerical Analysis of Copper Transport in SiO~2 During Bias Temperature Stress Test
British Library Conference Proceedings | 2003| -
Face-to-Face Chip Integration With Full Metal Interface
British Library Conference Proceedings | 2003| -
Process Optimization and Electrical Barrier Performance of Ultrathin Plasma Assisted Chemical Vapor Deposited TaSiN Films for Copper Metallization Applications
British Library Conference Proceedings | 2003| -
Integration of Plasma Deposited CF Polymer in a Copper/Low-k Damascene Architecture
British Library Conference Proceedings | 2003| -
Experimental Determination of the Effective Relative Permittivity of Copper/Low-epsilon~r Dual Damascene Integrated Structures
British Library Conference Proceedings | 2003|
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