Thick film MEMS process using reverse lift-off (English)
- New search for: Takase, S.
- New search for: Yamada, K.
- New search for: Nakagawa, Y.
- New search for: Oka, C.
- New search for: Sakurai, J.
- New search for: Hata, S.
- New search for: Takase, S.
- New search for: Yamada, K.
- New search for: Nakagawa, Y.
- New search for: Oka, C.
- New search for: Sakurai, J.
- New search for: Hata, S.
In:
Microelectronic Engineering
;
281
;
2023
-
ISSN:
- Article (Journal) / Electronic Resource
-
Title:Thick film MEMS process using reverse lift-off
-
Contributors:Takase, S. ( author ) / Yamada, K. ( author ) / Nakagawa, Y. ( author ) / Oka, C. ( author ) / Sakurai, J. ( author ) / Hata, S. ( author )
-
Published in:
-
Publisher:
- New search for: The Authors
-
Publication date:2023-08-11
-
ISSN:
-
DOI:
-
Type of media:Article (Journal)
-
Type of material:Electronic Resource
-
Language:English
-
Keywords:
-
Source:
Table of contents – Volume 281
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
-
Reliability challenges in CMOS technology: A manufacturing process perspectiveTeng, Qiao / Hu, Yongkang / Cheng, Ran / Wu, Yongyu / Zhou, Guodong / Gao, Dawei et al. | 2023
-
A simple figure of merit to identify the first layer to degrade and fail in dual layer SiOx/HfO2 gate dielectric stacksPadovani, Andrea / La Torraca, Paolo et al. | 2023
-
Thick film MEMS process using reverse lift-offTakase, S. / Yamada, K. / Nakagawa, Y. / Oka, C. / Sakurai, J. / Hata, S. et al. | 2023
-
Few layer chemical vapor deposited two dimensional WS2 for low voltage resistive switching applicationKhalid, Awais / Ahmad, Pervaiz / Saeedi, Ahmad M. / Liaqat, Iram / EL-Gawaad, N.S. Abd / Idris, Sahar Ahmed / Alanazi, Abdulaziz M. / Alsehli, Amal H. / Alsowayigh, Marwah M. / Alderhami, Suliman A. et al. | 2023
-
Strategies for avoiding delamination in system-in-packaging devicesAlaferdov, Andrei / Yoshioka, Ricardo T. / Nunes, Carolina C.P. / Sousa, Matheus Dias / Carvalho, Valdeci / Namba, Igor Fernandes / Coral, Claudemir et al. | 2023
-
Editorial Board| 2023
-
Nano-capsuled thermal interface materials filler using defective multilayered graphene-coated silver nanoparticlesChoi, Sungjun / Shin, Dongho / Kim, Sarah EunKyung / Yun, Changsun / Tan, Yik Yee / Lee, Caroline Sunyong et al. | 2023