A Statistical Study of Sn Whisker Population and Growth During Elevated Temperature and Humidity Tests (English)
- New search for: Peng Su,
- New search for: Howell, J.
- New search for: Chopin, S.
- New search for: Peng Su,
- New search for: Howell, J.
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In:
IEEE Transactions on Electronics Packaging Manufacturing
;
29
, 4
;
246-251
;
2006
- Article (Journal) / Electronic Resource
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Title:A Statistical Study of Sn Whisker Population and Growth During Elevated Temperature and Humidity Tests
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Contributors:
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Published in:IEEE Transactions on Electronics Packaging Manufacturing ; 29, 4 ; 246-251
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Publisher:
- New search for: IEEE
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Publication date:2006-10-01
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Size:2277469 byte
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ISSN:
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DOI:
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Type of media:Article (Journal)
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Type of material:Electronic Resource
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Language:English
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Source:
Table of contents – Volume 29, Issue 4
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 229
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Foreword Special Section on Tin Whiskers| 2006
- 229
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Special Section on Tin WhiskersGedney, R. W. et al. | 2006
- 231
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Tin Whisker Test Method DevelopmentSchroeder, V. / Bush, P. / Williams, M. / Nhat Vo, / Reynolds, H.L. et al. | 2006
- 231
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SPECIAL SECTION PAPERS - Tin Whisker Test Method DevelopmentSchroeder, V. et al. | 2006
- 239
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SPECIAL SECTION PAPERS - Humidity Effects on Sn Whisker FormationOberndorff, P. et al. | 2006
- 239
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Humidity Effects on Sn Whisker FormationOberndorff, P. / Dittes, M. / Crema, P. / Peng Su, / Yu, E. et al. | 2006
- 246
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A Statistical Study of Sn Whisker Population and Growth During Elevated Temperature and Humidity TestsPeng Su, / Howell, J. / Chopin, S. et al. | 2006
- 246
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SPECIAL SECTION PAPERS - A Statistical Study of Sn Whisker Population and Growth During Elevated Temperature and Humidity TestsSu, P. et al. | 2006
- 252
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SPECIAL SECTION PAPERS - The Effect of Annealing on Tin Whisker GrowthFukuda, Y. et al. | 2006
- 252
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The Effect of Annealing on Tin Whisker GrowthFukuda, Y. / Osterman, M. / Pecht, M. et al. | 2006
- 259
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Stress-Induced Tin Whisker Initiation Under Contact LoadingShibutani, T. / Qiang Yu, / Yamashita, T. / Shiratori, M. et al. | 2006
- 259
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SPECIAL SECTION PAPERS - Stress-Induced Tin Whisker Initiation Under Contact LoadingShibutani, T. et al. | 2006
- 265
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Microstructure-Based Stress Modeling of Tin Whisker GrowthJie-Hua Zhao, / Peng Su, / Min Ding, / Chopin, S. / Ho, P.S. et al. | 2006
- 265
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SPECIAL SECTION PAPERS - Microstructure-Based Stress Modeling of Tin Whisker GrowthZhao, J.-H. et al. | 2006
- 274
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SPECIAL SECTION PAPERS - Analysis of the Effects of Tin Whiskers at High FrequenciesEvans, R. et al. | 2006
- 274
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Analysis of the Effects of Tin Whiskers at High FrequenciesEvans, R. et al. | 2006
- 280
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Real-Time Quality Evaluation of Wire Bonding Using Input ImpedanceShih-Fu Ling, / Dong Zhang, / Sung Yi, / Say Wee Foo, et al. | 2006
- 285
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Multiple Orders Per Job Compatible Batch SchedulingErramilli, V. / Mason, S.J. et al. | 2006
- 297
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Preventing of Dewetting Effects for Inorganic–Organic Hybrid Polymers Applied in Sequentially Buildup (SBU) Technology Without Surface PretreatmentsUhlig, S. / Domann, G. / Houbertz, R. / Frohlich, L. / Schroder, H. / Krissler, J. / Lang, G. / Robertsson, M. et al. | 2006
- 308
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Using Transmission Laser Bonding Technique for Line Bonding in Microsystem PackagingTseng, A.A. / Jong-Seung Park, et al. | 2006
- 319
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IEEE Transactions on Advanced Packaging - Table of contents| 2006
- 321
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IEEE Transactions on Components and Packaging Technolog - Table of contents| 2006
- 323
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2006 Index| 2006
- C1
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Table of contents| 2006
- C2
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IEEE Transactions on Electronics Packaging Manufacturing publication information| 2006
- C3
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IEEE Components, Packaging, and Manufacturing Technology Society Information for authors| 2006
- C4
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IEEE Components, Packaging, and Manufacturing Technology Society Information| 2006