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Trench contact structures for advanced integrated circuit structure fabrication
Free accessEuropean Patent Office | 2023| -
Fin cut and fin trim isolation for advanced integrated circuit structure fabrication
Free accessEuropean Patent Office | 2023| -
Contact over active gate structures for advanced integrated circuit structure fabrication
Free accessEuropean Patent Office | 2023| -
3D semiconductor device and structure with multiple isolation layers
Free accessEuropean Patent Office | 2022| -
Gate cut and fin trim isolation for advanced integrated circuit structure fabrication
Free accessEuropean Patent Office | 2022| -
Heterogeneous metal line compositions for advanced integrated circuit structure fabrication
Free accessEuropean Patent Office | 2024| -
Methods for producing a 3D semiconductor memory device and structure
Free accessEuropean Patent Office | 2022| -
Die-on-interposer assembly with dam structure and method of manufacturing the same
Free accessEuropean Patent Office | 2022| -
Trench plug hardmask for advanced integrated circuit structure fabrication
Free accessEuropean Patent Office | 2022| -
Trench contact structures for advanced integrated circuit structure fabrication
Free accessEuropean Patent Office | 2021| -
Trench isolation for advanced integrated circuit structure fabrication
Free accessEuropean Patent Office | 2021| -
TRENCH ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION
Free accessEuropean Patent Office | 2023| -
GATE LINE PLUG STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION
Free accessEuropean Patent Office | 2021| -
Method to produce 3D semiconductor devices and structures with memory
Free accessEuropean Patent Office | 2022| -
Method for producing a 3D semiconductor memory device and structure
Free accessEuropean Patent Office | 2022|
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