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ZoomTree: Unrestricted Zoom Paths in Multiscale Visual Analysis of Relational Databases
British Library Conference Proceedings | 2011| -
Zonotope-based Nonlinear Model Order Reduction for Fast Performance Bound Analysis of Analog Circuits with Multiple-interval-valued Parameter Variations
British Library Conference Proceedings | 2014| -
Zoning types of mountain forest restoration in the upper Min River supported by image auto-recognition system [8009-143]
British Library Conference Proceedings | 2011| -
ZnS thin film deposited with chemical bath deposition process directed by different stirring speeds
British Library Online Contents | 2010| -
ZnS nanoparticles electrodeposited onto ITO electrode as a platform for fabrication of enzyme-based biosensors of glucose
British Library Online Contents | 2013| -
ZnO thin films produced by filtered cathodic vacuum arc technique
British Library Conference Proceedings | 2004| -
ZnO Quantum Dot Hybrid Luminescent Resists for Nanoimprint Lighography
British Library Online Contents | 2010| -
ZnO Nanomaterials Based Surface Acoustic Wave Ethanol Gas Sensor
Online Contents | 2012|Contributors: He, Y N, Yu, L M -
ZnO microrod/PDMS composites promote biaxially oriented growth of ZnO films on glass substrates
British Library Online Contents | 2014| -
Zirconyldichloride Modified Polycarbosilazane as Precursors for SiZrCNO Ceramics
British Library Conference Proceedings | 2016| -
Zinc Oxide Thin Films with Reduced Native Compensative Defects Grown by Ultrasonic Spray Pyrolysis at Atmosphere
British Library Conference Proceedings | 2007| -
Zinc Oxide Thin Films with Reduced Native Compensative Defects Grown by Ultrasonic Spray Pyrolysis at Atmosphere
British Library Online Contents | 2007| -
Zinc Oxide and Its Applications
British Library Conference Proceedings | 2014|Contributors: Topolov, Vitaly Yu -
Zinc and Tin-Zinc Via-Filling for the Formation of Through-Silicon Vias in a System-in-Package
Online Contents | 2009| -
Zinc and Tin-Zinc Via-Filling for the Formation of Through-Silicon Vias in a System-in-Package
Springer Verlag | 2009| -
Zinc and Tin-Zinc Via-Filling for the Formation of Through-Silicon Vias in a System-in-Package
Online Contents | 2009|
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