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Subcooled Boiling Heat Transfer for Cooling of Power Electronics in Hybrid Electric Vehicles
Online Contents | 2015|Keywords: Elektronisches Bauelement -
Multi-physics Analysis for Temperature Rise of Electric Connectors Using a Multi-scale Model
Online Contents | 2015|Keywords: Elektronisches Bauelement -
Experimental Analysis of a Novel Piezoelectric Jetting System for Micrograms Deposition in Electronic Assemblies
Online Contents | 2017|Keywords: Elektronisches Bauelement -
Effect of Solder Joint Thickness on Intermetallic Compound Growth Rate of Cu/Sn/Cu Solder Joints During Thermal Aging
Online Contents | 2016|Keywords: Elektronisches Bauelement -
Single- and Two-Phase Particle Image Velocimetry Characterization of Fluid Flow Within a Liquid Immersion Cooled Electronics Module
Online Contents | 2016|Keywords: Elektronisches Bauelement -
Erratum: “Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study” [ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069]
Online Contents | 2016|Keywords: Elektronisches Bauelement -
Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical Characteristics
Online Contents | 2015|Keywords: Elektronisches Bauelement -
Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples
Online Contents | 2016|Keywords: Elektronisches Bauelement -
Influence of Glass Transition Temperature of Underfill on the Stress Behavior and Reliability of Microjoints Within a Chip Stacking Architecture
Online Contents | 2015|Keywords: Elektronisches Bauelement -
Erratum: “Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks” [ASME J. Electron. Packag., 2016, 138(4), p. 041009; DOI: 10.1115/1.4034927]
Online Contents | 2017|Keywords: Elektronisches Bauelement -
Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions
Online Contents | 2016|Keywords: Elektronisches Bauelement -
Enhanced Bonding by Applied Current in Cu-to-Cu Joints Fabricated Using 20 μm Cu Microbumps
Online Contents | 2017|Keywords: Elektronisches Bauelement -
Modular Microfluidic Filters Based on Transparent Membranes
Online Contents | 2016|Keywords: Elektronisches Bauelement -
Stress–Strain Behavior of SAC305 at High Strain Rates
Online Contents | 2015|Keywords: Elektronisches Bauelement -
Transient Response of an Oscillating Heat Pipe by a Pulsed Heating in a High Magnetic Field Environment
Online Contents | 2015|Keywords: Elektronisches Bauelement -
A Study on Electrical Reliability Criterion on Through Silicon Via Packaging
Online Contents | 2016|Keywords: Elektronisches Bauelement -
A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat Conduction
Online Contents | 2016|Keywords: Elektronisches Bauelement -
A new analytical method for calculating maximum junction temperature of packaged devices incorporating the temperature distribution at the base of the substrate
Online Contents | 2015|Keywords: Elektronisches Bauelement -
Analysis of ZnO thin film as thermal interface material for high power LED application
Online Contents | 2015|Keywords: Elektronisches Bauelement
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